| Research Progress of Thermal Conductive Gels |
| Received:February 03, 2023 Revised:February 03, 2023 |
| DOI：10.12136/j.issn.1000-890X.2023.12.0994 |
| Key Words: thermal conductive gel；gel matrix；thermal conductive filler；thermal conductivity |
| Author Name | Affiliation | E-mail | | MIAO Xiaodong* | Beijing Aerospace Automatic Control Research Institute | miaoxiaodong310@163.com | | WANG Dalin | Beijing Aerospace Automatic Control Research Institute | | | QIU Xiaofeng | Beijing Aerospace Automatic Control Research Institute | | | ZHANG Lihua | Beijing Aerospace Guanghua Electronic Technology Co.，Ltd | |
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| Abstract: |
| The composition and thermal conduction mechanism of the thermal conductive gel are
summarized，and the research progress of silicon-based and non-silicon-based thermal conductive gel
matrices，as well as the ceramic materials，carbon based materials and composite fillers as thermal conductive
fillers are introduced. The thermal conductive gel has the advantages of high thermal conductivity，good high
and low temperature resistance and insulation properties，strong plasticity，viscosity and adhesion，and can be
reused. The key to improving the comprehensive performance of the thermal conductive gel lie in the rational
design of the properties of the matrix and fillers. The design of the matrix could be carried out from the
type and molecular weight of the polymer and its distribution，cross-linking agent，chain extender，etc. ，and
the polymer could be modified by changing the structure and arrangement of molecular chains. The design
of the fillers could be carried out from the perspective of improving thermal conductivity，such as surface
functionalization of traditional thermal conductive fillers and the design of composite fillers. |
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