文章摘要
Preparation and Properties of Hollow Glass Microsphere/NR Low Thermal Conductivity Composites
Received:August 17, 2022  Revised:August 17, 2022
DOI：10.12136/j.issn.1000-890X.2024.04.0243
Key Words: HGM；NR；silica；thermal conductivity；rolling resistance
Author NameAffiliationE-mail
YAN Lizhi Qingdao University of Science and Technology 781353687@qq.com 
XIAO Yao Qingdao University of Science and Technology  
TANG Shaoshu Qingdao University of Science and Technology  
LIANG Jinzhou Qingdao University of Science and Technology  
XU Zhenchun Qingdao University of Science and Technology  
WANG Chuansheng* Qingdao University of Science and Technology wcsmta@qust.edu.cn 
BIAN Huiguang Qingdao University of Science and Technology  
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Abstract:
      The preparation and properties of hollow glass microsphere（HGM）/natural rubber（NR） low thermal conductivity composites（referred to as compounds） were introduced.The results showed that replacing silica with an appropriate amount of HGM effectively reduced the storage modulus and Mooney viscosity of the compound，and improved the processing properties of the compound，but it was not conducive to the physical properties of the compound.Reducing the amount of HGM could improve the tensile strength，elongation at break and tear strength of the compound，but it could reduce the wear resistance of the compound.Replacing silica with an appropriate amount of HGM was beneficial for the lightweighting of the compound and improving the heat insulation properties of the compound，and effectively reduced the rolling resistance of the compound.
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