| Preparation and Properties of Electrical Insulated and Thermal Conductive Addition-Cure Silicone Encapsulant |
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| DOI： |
| Key Words: silicone encapsulant；addition-cure；electrical insulating；thermal conductive |
| Author Name | Affiliation | | PAN Kexue | South China University of Technology | | LAI Xuejun | South China University of Technology | | LI Hongqiang | South China University of Technology | | HU Xinsong | Guangzhou Glorystar Chemical Co.，Ltd | | ZENG Xingrong | South China University of Technology |
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| Abstract: |
| In this study，the electrical insulating and thermal conductive addition-cure silicone encapsulant was prepared and its properties were investigated.The results showed that，when the mass ratio of vinyl end silicone oils with viscosity of 300 and 1 000 mPa·s was 40∶60，active hydrogen mass fraction of hydrogen-containing silicone oil was 0.005 0 and molar ratio of SiH and SiVi was 1.2，the physical properties of silicone encapsulant were good.When the addition level of Al2O3 was 150 phr，the silicone encapsulant had good comprehensive performance. |
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