| Effect of Aluminium Hydroxide on Properties of Thermal Conductive Addition-Cure Silicone Encapsulant |
| Received:July 14, 2015 Revised:July 14, 2015 |
| DOI： |
| Key Words: silicone encapsulant; addition-cure; flame retardant; thermal conductivity |
| Author Name | Affiliation | E-mail | | PAN Ke-xue | College of Materials Science and Engineering,South China University of Technology | kxpan19@gmail.com | | LAI Xue-jun | College of Materials Science and Engineering,South China University of Technology | | | LI Hong-qiang | College of Materials Science and Engineering,South China University of Technology | | | ZENG Xing-rong* | College of Materials Science and Engineering,South China University of Technology | psxrzeng@gmail.com |
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| Abstract: |
| Halogen-free flame retardant and thermal conductive addition-cure silicone encapsulant was prepared using complex of vinyl end silicone oils with viscosity of 300mPa.s and 1000mPa.s, hydrogen silicone oil as cross-linker, alumina (Al2O3) as thermally conductive filler, aluminium hydroxide (Al(OH)3) as flame retardant. The effect of aluminium hydroxide on properties of thermal conductive addition-cure silicone encapsulant was investigated. The results showed that with the increase of the amount of Al(OH)3, flame retardancy and thermal conductivity of the encapsulant enhanced, viscosity of the encapsulant increased, and volume resistivity and mechanical properties of the encapsulant decreased. When the content of Al(OH)3 was 60phr, silicone encapsulant showed good comprehensive performance. |
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