| Properties of Dough Moulding Compound/SBR/MVQ Electrically Insulating Composite |
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| DOI： |
| Key Words: MVQ；SBR；dough moulding compound；composite；electrically insulating property；oxygen index |
| Author Name | Affiliation | | WU Weili | Qiqihar University | | ZHANG Yu | Qiqihar University |
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| Abstract: |
| The dough moulding compound（DMC）/SBR/MVQ electrically insulating composites were prepared，and their properties were investigated.The results showed that，compared with BR，NBR，ACM and EPDM，when SBR was used as compatibilizer，the compatibility between DMC and MVQ was improved，the physical properties and oxygen index of DMC/SBR/MVQ insulating composite were increased，and the optimum mass ratio of DMC/SBR/MVQ was 60/25/75.The optimum mixing process was as follows: MVQ and SBR were mixed separately，silica was added in several mixing steps，DMC was added by batch method，and then the MVQ and SBR compounds were blended.The optimum mixing mode was that silica added by subsection method，DMC added by batch method，MVQ and SBR mixed respectively，and then blended.The optimum cure condition was 180 ℃/1.2 MPa×15 min.Under this process，DMC/SBR/MVQ composite possessed good electrically insulating property，and its flame retardancy reached the requirement of cable insulation material. |
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