| Analysis of delay phenomenon on rheometer |
| |
| DOI： |
| Key Words: rheometer；cure；curing characteristics；delayed time；heat transfer analysis |
| Author Name | Affiliation | | CHEN Li-fang | Beijing University of Chemical Technology | | WANG Yong-tao | Beijing University of Chemical Technology | | XU Ze-ming | Beijing University of Chemical Technology |
|
| Hits: 611 |
| Download times: 566 |
| Abstract: |
| The delay phenomenon on the rheometer in testing the curing behavior of rubber compound at the first time was analysed.It was found from the experiment analysis and heat transfer analysis that the temperature on the rotor surface in the rheometer mold cavity filled with air was lower
than that filled with rubber compound resulting in the slower cure of rubber compound on the rheometer in the first test and the delayed times for curing characteristics (ts1，t10，t50和t90 etc.).The delayed times could be reduced by lasting the temperature rising time of rheometer mold cavity before the test. |
|
View Full Text
View/Add Comment Download reader |
| Close |
