文章摘要
过氧化物硫化体系对氯丁橡胶胶料性能的影响
Effect of Peroxide Vulcanization Systems on Properties of CR Compounds
投稿时间:2024-03-11  修订日期:2024-03-29
DOI:10.12136/j.issn.1000-890X.2025.12.0918
中文关键词: 氯丁橡胶  过氧化物硫化体系  助交联剂  Payne效应  动态力学性能
英文关键词: CR  peroxide  vulcanization system  coagent  Payne effect  dynamic mechanical property
基金项目:国家重点研发计划重点专项资助项目(2018YFC1902600)
作者单位E-mail
马春临 青岛科技大学橡塑材料与工程教育部重点实验室 1250641138@qq.com 
赵怡然 青岛科技大学橡塑材料与工程教育部重点实验室  
李培军* 青岛科技大学橡塑材料与工程教育部重点实验室 li@qust. edu. cn 
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中文摘要:
      究过氧化物硫化体系对氯丁橡胶(CR)胶料性能的影响。结果表明:当助交联剂为TAIC和DTMPTA时,过氧化物BIPB或双25均可以有效地硫化CR胶料,采用BIPB的CR胶料的硫化速率更快,160 ℃下的t90约为8 min,DTMPTA对CR胶料的硫化促进效果好于TAIC;在助交联剂相同时,采用BIPB的CR胶料的Payne效应更强,不利于填料分散,采用双25的CR硫化胶的拉伸强度、拉断伸长率和撕裂强度大于采用BIPB的CR硫化胶,但硬度和100%定伸应力较小;助交联剂为DTMPTA的CR硫化胶的损耗因子较小,生热更低。
英文摘要:
      The effect of peroxide vulcanization systems on the properties of chloroprene rubber(CR) compounds was studied.The results showed that,when the coagent was TAIC or DTMPTA,the peroxide BIPB and DBPH could effectively vulcanizate CR compounds.The vulcanization rate of CR compound with BIPB was faster,the t90 at 160 ℃ was about 8 min. DTMPTA had a superior acceleration effect on the crosslinking of CR compound than TAIC.When the coagent was the same,the Payne of CR compound with BIPB was stronger,which was not conducive to filler dispersion,the tensile strength,elongation at break and tear strength of CR compound with DBPH were greater than those of the compound with BIPB,but the hardness and modulus at 100% were lower.The CR vulcanizate with DTMPTA exhibited a lower loss factor,indicating a reduced heat build-up.
Author NameAffiliationE-mail
MA Chunlin Key Laboratory of Rubber and Plastic Materials and Engineering, Qingdao University of Science and Technology, Ministry of Education 1250641138@qq.com 
ZHAO Yiran Key Laboratory of Rubber and Plastic Materials and Engineering, Qingdao University of Science and Technology, Ministry of Education  
LI Peijun Key Laboratory of Rubber and Plastic Materials and Engineering, Qingdao University of Science and Technology, Ministry of Education li@qust. edu. cn 
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