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| 导热垫片导热性能的影响因素分析 |
| Analysis of Influencing Factors of Thermal Conductivity of Thermal Conductive Gasket |
| Received:August 24, 2020 Revised:August 24, 2020 |
| DOI：10.12137/j.issn.2095-5448.2021.02.0068 |
| 中文关键词: 导热垫片；导热系数；热阻；硬度；导热粉体；空穴 |
| 英文关键词: thermal conductive gasket；thermal conductivity；thermal resistance；hardness；thermal powder；gas hole；silicone rubber |
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| Author Name | Affiliation | E-mail | | sujunjie* | 00 | sujunjiequst@163.com | | limiao | 00 | | | fengyihong | 00 | | | zengxingrong | 00 | | | 程献涛 | 00 | | | wuxiangrong | 00 | |
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| 中文摘要: |
| 分析硬度以及测试条件对导热垫片导热性能的影响。结果表明：随着硬度的增大，导热垫片的导热系数减小，热阻增大，适宜硬度为70度；随着测试压力的增大，导热垫片的导热系数增大，热阻减小，适宜测试压力为345 kPa；随着测试温度的升高，导热垫片的导热系数增大，热阻减小，适宜测试温度为80 ℃；减少导热垫片内部气体空穴，能够增大导热粉体接触几率，有助于改善导热垫片的导热性能。 |
| 英文摘要: |
| The influence of hardness and test conditions on the thermal conductivity of thermal conductive gasket was analyzed.The results showed that，with the increase of hardness，the thermal conductivity decreased and the thermal resistance increased，and the suitable hardness was 70.With the increase of test pressure，the thermal conductivity increased and the thermal resistance decreased，and the suitable test pressure was 345 kPa.With the increase of test temperature，the thermal conductivity increased and the thermal resistance decreased，and the suitable test temperature was 80 ℃.Reducing the gas hole in the thermal conductive gasket could increase the contact probability of the thermal conductive powder，which was helpful to improve the thermal conductivity of the thermal conductive gasket. |
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